Bu çalışmada, RadFET’lerin kapı oksit tabakasına
implante edilmiş B+ iyonlarının Vth üzerine etkisi,
Silvaco TCAD benzetim programı ile incelenmiştir. 300 nm ve 400 nm
kalınlıklarında kapı oksite sahip RadFET’ler, tüm üretim adımları TCAD’e
tanıtılarak tasarlanmıştır. İmplantasyon öncesi ve sonrası Vth
değerleri, RadFET’lerin akım-gerilim (Id-Vg) karakteristiklerinden
elde edilmiştir. Artan implantasyon enerjisi, Vth değerlerinin
düşmesine neden olmuştur. Vth değerinin sıfır olması, daha geniş
ölçülebilir doz aralığına sahip RadFET’lerin üretilmesi için önemlidir. Ancak,
implantasyon enerjisindeki sürekli artışla birlikte Vth, p-kanalı
oluşumu nedeniyle negatif voltaj değerlerinde gözlenmemiştir. 300 nm-RadFET
için en düşük Vth değeri, 6.5×1011 iyon/cm2 bor dozu
ve 72 keV’de, -1.082 V olarak bulunmuştur. 400 nm-RadFET için bu değer, 2.3×1011
iyon/cm2 bor dozu ve 106 keV’de, -1.139 V olarak elde edilmiştir.
In this study, the effect of the B+
ions implanted to gate oxide layer of the RadFETs on Vth was
investigated by Silvaco TCAD simulation program. The RadFETs with the gate
oxide thicknesses of 300 nm and 400 nm were designed by introducing the all of
the RadFETs production steps to TCAD. The Vth values were obtained
from the current-voltage (Id-Vg) characteristics of the RadFETs
before and after implantation. Increasing implantation energy caused the
reduction of the Vth values. The zero Vth value is
important to produce the RadFET with broader measurable dose range. However, Vth
was not observed in the negative voltages with continuous increment in the
implantation energy due to the p-channel formation. For the 300 nm-RadFET, the
lowest Vth value was found as -1.082 V for boron dose with 6.5×1011
ions/cm2 at 72 keV. This value for 400 nm-RadFET was obtained as
-1.139 V for boron dose with 2.3×1011 ions/cm2 at 106
keV.
Subjects | Engineering |
---|---|
Journal Section | Research Articles |
Authors | |
Publication Date | August 20, 2017 |
Submission Date | November 1, 2016 |
Acceptance Date | June 5, 2017 |
Published in Issue | Year 2017 Volume: 22 Issue: 2 |
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